Rotating probe: What are the different types of probes?
Release date:
2022-09-02
It is a type of test probe used in electronic testing to inspect PCBA assemblies. The probe is gold-plated and belongs to the high-end category of electronic components. Probes made from different materials exhibit varying performance characteristics. Probes fabricated from tungsten (W) and rhenium‑tungsten (ReW) alloys tend to shift easily but offer only moderate elasticity; they are prone to picking up gold debris, wear out quickly, require frequent cleaning, and have a relatively short service life. In contrast, probes made from material A provide excellent elasticity, remain stable during testing, do not adhere to gold foil, and eliminate the need for cleaning, resulting in a longer lifespan. So, regarding rotary probes: what types of probes can be classified?
Rotating probe: What are the different types of probes?
It is a type of test probe used in electronic testing to evaluate PCBA assemblies. The probe is gold-plated and belongs to the high-end category of electronic components. Probes made from different materials exhibit varying performance characteristics. Probes crafted from tungsten (W) and rhenium‑tungsten (ReW) alloys tend to shift easily, though their elasticity is moderate; they also readily accumulate gold debris, wear out quickly, require frequent cleaning, and have a relatively short service life. In contrast, probes made from material A offer superior elasticity, remain stable during testing, do not adhere to gold foil, and eliminate the need for cleaning, resulting in a longer lifespan. So, regarding rotary probes: what types of probes can be classified?
Rotating probe: What are the different types of probes?
1. ICT probe: Primarily used for in-circuit testing and functional testing, also known as ICT testing and FCT testing, it is a widely employed type of probe.
2. Interface probe: A non-standard probe, typically custom‑made for a small number of customers who manufacture large testing machines, used to measure the contact points and surface conditions between the testing machine and the test fixture.
3. Microprobe: The center-to-center distance between two test points is typically 0.25 mm to 0.76 mm.
4. Switch probe: The individual probe of the switch probe has two current paths.
5. High-frequency probe: Used for testing high-frequency signals, including models with a shielding ring capable of measuring up to 10 GHz, and models without a shielding ring rated for 500 MHz.
6. Rotary probe: Typically has low elasticity, as it inherently offers strong penetration; it is generally used for testing PCBA assemblies after OSP treatment.
7. High‑current probe: The probe diameter ranges from 2.54 mm to 4.75 mm, with a maximum test current of up to 39 amperes.
8. Semiconductor probes: typically have diameters ranging from 0.50 mm to 1.27 mm, with bandwidths exceeding 10 GHz and 50-ohm impedance characteristics.
9. Battery contact probe: Typically used to optimize contact performance, offering excellent stability and a long service life.
10. Automotive wiring harness test probe: Specifically designed for continuity testing of automotive wiring harnesses, with a diameter of 1.0–3.5 mm and a current rating of 3–50 A.
Rotating Probe: What are the precautions for a four‑probe resistivity tester?
1. Please read the instruction manual carefully and operate the instrument in accordance with the guidelines before use.
2. Handle with care, avoid instrument vibration, place it horizontally, and perform measurements in a vertical position.
3. When the instrument is not in use, please disconnect the power supply. Do not frequently unplug the connecting cables to prevent dust from entering the aviation connector and causing a short circuit.
4. After completing the probe pen test, put on the protective sleeve to prevent accidental needle breakage.
5. The four‑probe tester is a versatile, multi‑purpose measurement instrument based on the four‑probe principle. It can measure the resistivity of silicon and germanium single crystals, the sheet resistance of silicon epitaxial layers, diffusion layers, and ion‑implanted layers, as well as the sheet resistance of conductive films such as those on conductive glass. It is primarily used to evaluate the electrical conductivity of semiconductor thin films and wafers, and is widely employed by semiconductor manufacturers and in the solar‑energy industry; it also meets the needs of research institutes conducting precision studies.
6. The four‑probe resistivity tester is characterized by a host unit equipped with an even‑numbered digital meter. While measuring resistivity, another digital meter—accurate to within a few parts per ten thousand—monitors current variations in real time throughout the entire measurement process, eliminating the need to convert between current and resistivity measurements and enabling more timely control of the measurement current. Additionally, the host provides a constant‑current source with an accuracy of 0.05%, ensuring highly stable measured currents.
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